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Electrical Connections
Footprint
Terminal
Number
1
2
3
Connection
V CC
Ground
NC or Ground
1
2
3
4
8
7
6
5
Actual size footprint:
4
5
Q Output
Q Output
6
7
8
LID
Ground
ENABLE
Ground
TOP VIEW
Typical Printed Circuit Board Land Pattern
A typical land pattern for a circuit board is shown below. Grounding of the
metallic center pad is optional.
Case Design
All pads consist of 30 microinches (min) electroless gold on 50 microinches
(min) electroless nickel over base metal. The metallic center pad was
designed for mechanical support. Grounding of this pad is optional.
Lid symbolization, including terminal 1 locator dot, are in contrasting ink.
Symbolization varies by model number. For purposes of illustration, only
terminal 1 dot is shown.
.
Typical Test Circuit
Typically 0.01" to 0.05" or 0.25 mm to
1.25 mm (8 Places)
(The optimum value of this dimension is
dependent on the PCB assembly process
employed.)
B
C
D
E
A
N (X8)
M
L
K
J
G
F (X8)
(X3)
H (X2)
V cc
4.7 μ H
0.1 μ F
V cc
Clock
Under Test
Sine-Wave
Signal Generator
50 Ω
Q
50 Ω
Q
*
*
Tektronix
CSA 803
Digitizing
Oscilloscope
Ch 1
Trigger
Ch 2
ENABLE
50 Ω
Dimensions
Millimeters
Inches
*Power Splitter, Mini-Circuits ZFSC2-4
Min
Max
Min
Max
A
13.46
13.97
0.530
0.550
B
9.14
9.66
0.360
0.380
Timing Definitions
C
2.05 Nominal
0.081 Nominal
D
E
F
3.56 Nominal
2.24 Nominal
1.27 Nominal
0.141 Nominal
0.088 Nominal
0.050 Nominal
Propagation Delay:
ENABLE
G
H
J
K
L
M
N
2.54 Nominal
3.05 Nominal
1.93 Nominal
5.54 Nominal
4.32 Nominal
4.83 Nominal
0.50 Nominal
0.100 Nominal
0.120 Nominal
0.076 Nominal
0.218 Nominal
0.170 Nominal
0.190 Nominal
0.020 Nominal
50%
Q or Q Output
Amplitude
Envelope
t PD
90%
50%
t PD
10%
Materials
Solder Pad Ter- Au plating 30 - 60 μinches (76.2-152 μm) over 80-200
mination μinches (203-508 μm) Ni.
Symmetry:
Q or Q Output
Lid
Fe-Ni-Co Alloy Electroless Nickel Plate (8-11% Phos-
50%
50%
50%
phorus) 100-200 μinches Thick
Body
Al 2 O 3 Ceramic
Symmetry as
% of Period
Symmetry as
% of Period
Period
www.RFM.com E-mail: info@rfm.com
?2008 by RF Monolithics, Inc.
Page 2 of 2
SC3040B - 3/27/08
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